These wafers are the largest in the world, and they require more advanced and expensive equipment and technology to produce. The production process involves melting high-purity silicon in a quartz crucible and pulling a single crystal from the melt using a rotating seed crystal. This technique is called the Czochralski (CZ) crystal growth process, and it can produce large-diameter ingots with uniform doping and low defect density. However, the CZ process also consumes more energy, materials, and time than smaller wafers.
The finishing process is difficult and costly to slice, polish, etch, and clean than smaller wafers. The wafers are sliced into thin disks using diamond saws or wire saws, which can cause cracks or chips on the edges. The wafers are then polished to remove any surface defects or impurities, which can reduce the thickness and diameter of the wafers. The wafers are then etched to create a smooth and uniform surface, which can also affect the quality and yield of the wafers.
The larger 12 inch wafers are in higher demand than smaller wafers, as they can accommodate more complex and sophisticated circuits and devices. The 12 inch silicon wafer is used primarily for memory and other products, such as PCs and mobile phones. The 12 inch silicon wafer is more efficient for precision processes, which make them more profitable for manufacturers. However, the supply of 12 inch silicon wafers is limited by the capacity and expansion plans of the major silicon wafer makers, such as GlobalWafers, Shin-Etsu, and Sumco4.
The average price of a 12 inch silicon wafer processed using the N5 (5nm) technology was about $16,988 per wafer in 20201. However, the price can vary significantly depending on the market conditions and the specifications of the customers.
© 2023 Silicon Masters LLC - All Rights Reserved