Golden Centipede (64-pin C-DIP (Ceramic Dual Inline Package)

64-pin C-DIP (Ceramic Dual Inline Package) chip package:
The Dual Inline Package (DIP) is one of the earliest standardized integrated circuit packages. It was developed in the 1960s as a compact and reliable way to package and protect semiconductor chips.

The ceramic DIP (C-DIP) package emerged in the 1970s as a variant of the original plastic DIP, offering better thermal and mechanical properties.
The 64-pin C-DIP package became popular in the 1980s and 1990s for housing complex microprocessors, memory chips, and other high-density integrated circuits. It provided a higher pin count than earlier DIP packages, allowing for more input/output connections and functionality.

The 64-pin C-DIP is a rectangular ceramic package with two parallel rows of 32 pins each, spaced 0.1 inches (2.54 mm) apart. The package body is made of a ceramic material, typically alumina (Al2O3), which has excellent thermal conductivity and electrical insulation properties.

The pins are typically made of a metallic alloy, such as Kovar (iron-nickel-cobalt alloy) or Alloy 42 (iron-nickel alloy), chosen for their thermal expansion properties to match the ceramic body and prevent cracking.

Inside the package, the semiconductor chip is mounted on a lead frame and connected to the pins via thin metal wires using a process called wire bonding. The chip and wire bonds are then encapsulated in a ceramic body for protection.